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July 25, 2012
By: DAVID SAVASTANO
Sensors are quickly becoming one of the best potential uses for printed electronics (PE), as the combination of flexible form factors, functionality and cost are indeed intriguing. Thus, the news that Bemis Company, a leading supplier of flexible packaging and pressure sensitive materials with sales of $5.3 billion in 2011, and Thin Film Electronics ASA (Thinfilm) are working together on Thinfilm’s Intelligent Packaging Platform to develop a flexible sensing platform for the packaging market ...
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